Paras Semiconductors aims to set up an advanced heterogeneous integration and 3D packaging OSAT facility in India.
Paras Semiconductors, a subsidiary of Paras Defence & Space Technologies Limited, announced a strategic technology partnership with BroadPak Corporation, USA, to accelerate the development of advanced semiconductor packaging capabilities in India.
Through the partnership, Paras Semiconductors aims to establish an advanced heterogeneous integration and 3D packaging OSAT (Outsourced Semiconductor Assembly and Test) facility in India. It will gain access to BroadPak’s advanced design, manufacturing and integration intellectual property, alongside technology transfer and process know-how in 2.5D/3D packaging and chiplet integration.
BroadPak Corporation, headquartered in San Jose, California, was founded in 2007.
“Our entry into the semiconductor sector represents a strategic expansion into a technology domain that is increasingly critical to India’s AI and data centres and industrial capabilities,” said Munjal Sharad Shah, Managing Director, Paras Defence & Space Technologies Limited.
According to Yole Group estimates presented at the 2026 IMAPS Device Packaging Conference, the global advanced packaging market is projected to grow from over US$40 billion in 2024 to more than US$80 billion by 2030.
